| Whats New |
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| New project to develop RoHS compliance
analysis methodology |
| The Restriction of the use of certain Hazardous Substances
in electrical and electronic equipment (RoHS) Directive
became EU law on the 13th February 2003. The directive
requires that most new electrical and electronic products
sold in Europe from 1st July 2006 shall not use six particular
materials: lead, cadmium, mercury, hexavalent chromium
and two flame retardants. The responsibility for ensuring
that products comply rests with each producer. |
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| Producers and enforcement agencies require a commonly
agreed approach for assessing the compliance or otherwise
of any product within the scope of the directive. Currently
no such mechanism exists. |
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| A number of major electrical product manufacturers have
recently approached ERA asking how they can demonstrate
compliance with the directive. In response, ERA proposes
to develop a suitable methodology which will enable producers
to demonstrate compliance. |
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| First lead-free soldering
and design for the environment courses a success |
| ERA ran courses on these two subjects in May and June
respectively. With a very practical approach, both courses
were very well received. The lead-free course included
a review of how industry is progressing in making the
transition. (This will be covered in more detail in the
next issue of RFAnews.) The informal atmosphere encouraged
a lively interaction between audience and speakers. These
course are being repeated in November. |
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| Features |
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| Designing products to avoid failures
in the field |
| Fixing problems in the field is always many times more
costly than eradicating them before they occur. ERA's
Reliability and Failure Analysis Group assists in all
aspects of the product lifecycle. This article provides
useful guidance on getting it right first time through
good design practice. |
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| Contamination and moisture effects
on printed circuit board reliability |
| The combination of surface contamination, high ambient
humidity and an applied voltage can lead to a number of
failure mechanisms in printed circuit boards. Common effects
include corrosion of metals and the formation of metal
filaments between tracks and component terminations. |
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| Upcoming Events |
Course - Changing to
Lead Free Solders
Date: 12 May 2004 - venue Leatherhead
Description: The Restriction of certain Hazardous
Substances (RoHS) directive bans the sale within the EU
of a wide variety of electrical equipment containing tin-lead
solders from July 2006. This course covers: |
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How the drive towards lead-free will affect you
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What are the differences between tin-lead and
lead-free solders |
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What difficulties can occur and how to avoid them |
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Who is already using lead-free around the world
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Course - Design for the Environment (DfE)
for electronic and electrical equipment
Date: 13 November 2003 - venue Leatherhead
Description: Design for the Environment techniques
offer cost savings, can pre-empt future legislation and
demonstrate a "green" image to customers. This
course covers: |
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What Design for the Environment (DfE) is and how
it can help your business |
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How DfE is used |
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Techniques and ideas for DfE that could result
in long term cost savings |
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Design and compliance issues |
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What others have done with DfE |
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Conference - Designing and Recycling Electrical and Electronic Equipment
Date: 18-19 November 2003 - venue Regents Park
Marriott Hotel, London
Description: This annual event attracts an international
audience and speakers covering all aspects of WEEE, RoHS
and other environmental issues impacting on this industry
sector. Speakers this year include the CBI, DTI, Clariant,
Lucent Technologies, Eurosource Europe, Brother UK, Wincanton,
Intellect, ERA, Flextronics, WEEE Executing Forum, Sanyo,
London Remade, RS Components, Plestech, Nokia, Selway
Moore, Electrolux, and TCO Development. |
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Reliability
and Failure Analysis News - Issue 5
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