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Reliability and Failure Analysis News - Issue 4

Whats New
 
NEMI Lead-free soldering report
The National Electronics Manufacturing Initiative (NEMI) in the USA has recently published its report on lead-free soldering. Based on work from 30 participating organisations it has concluded that SnAgCu solders are suitable replacements for SnPb for surface mount technology. It is being used successfully in production and has performed well in reliability testing.
 
ERA is currently carrying out a survey on lead-free soldering and this conclusion agrees with the opinions of most European manufacturers who are developing lead-free production. Although the NEMI conclusions are factually correct, the situation is not a simple as this. SnAgCu solder is quite different to traditional tin lead solders and changes to equipment, manufacturing processes and in many cases components will be needed, Significant technical difficulties do exist and manufacturers will need to understand these in order to produce reliable and consistent products. This can be costly and time consuming if expert advise is not sought at an early stage - Motorola spent $1.5 million developing their first lead-free solder mobile phones.
 
ERA can provide technical assistance with changing to lead-free soldering, assessing the quality of products made using lead-free solders.
 
Designing and Recycling Electrical and Electronic Equipment
A review of the conference and a further article on lead-free solders are published in RE4view or you can obtain the proceedings of the conference.

Features
 
Waste Electrical and Electronic Equipment (WEEE) Recycling at End-of-Life
The WEEE directive, which entered into force as European law on 13th February 2003, will result in a major change in the treatment of electrical equipment at end-of-life. The numbers and range of product types and materials that will arise as a result has not been quantified. ERA has recently developed a predictive model for end of life PCs and mobile phones.


Upcoming Events
 
Course - Changing to Lead Free Solders
Dates 12 May 2004 and 6 October 2004- venue Leatherhead
 
The Restriction of certain Hazardous Substances (RoHS) directive will ban the sale within the EU of a wide variety of electrical equipment containing tin-lead solders. This course covers:
 
How the drive towards lead-free will affect you
What are the differences between tin-lead and lead-free solders
What difficulties can occur and how to avoid these
Who is already using lead-free around the world
 
Course - Design for the Environment (DfE) for electronic and electrical equipment
Date 11 May 2004 - venue Leatherhead
 
Design for the Environment techniques offer cost savings, can pre-empt future legislation and demonstrate a "green" image to customers. This course covers:
 
What Design for the Environment (DfE) is and how it can help your business
How DfE is used
Techniques and ideas for DfE that could result in long term cost savings
What others have done with DfE

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